PTASACLEAN purging compound

Low-residue grade for PC and PC/ABS

Confirm additives below 5% and control residence time above 300°C

200–360°COperating temperature

Definition & positioning

What jobs fits PT

Low-residue grade for PC and PC/ABS. Use for transparent jobs, color change and chase-purging after NewEX — verify TDS limits before use

Process: Injection including Hot Runner; profile/sheet/blown film/compounding
Resin: PC and PC/ABS; additives below 5%
Temperature: 200–360°C
Objectives: Transparent jobs, color change and chase-purging after NewEX
Hot Runner: Compatible; TDS sets no minimum clearance
Glass Fiber / Additives: Not concluded GF-free; TDS states additives below 5%
Machine Sealing: Machine sealing compatible
Residence / Clearance: Max 30 min residence above 300°C

Strengths

Covers PC and PC-ABS up to 360°C as a low-residue grade

Transparent jobs, color change and chase-purging after NewEX

Constraints

Confirm additives below 5% and control residence time above 300°C

Check on site: Temperature, resin type, Hot Runner, clearance, screen mesh and residence time

Basic operation

Confirm PT resin and temperature
Purge old resin and set the machine per TDS, observing: max 30 min residence above 300°C
Feed purging compound; adjust back pressure and screw speed to machine state
Chase purging compound out with next resin; verify cleanliness before production

NewM
Low-residue grade for PMMA and transparent jobs RE
R-Series low-residue grade for transparent or unreinforced resins NewEX
High-cleaning grade for carbon residue, color and screw-pull jobs

The TDS is the authoritative document for temperature range, process and limits

At what temperature does PT run

The confirmed range for PT is 200–360°C

Can PT run Hot Runner

Compatible; TDS sets no minimum clearance

Can PT seal machines

Machine sealing compatible

CSC technicians verify terms, set the baseline and define pass criteria